Engineer - Package Design
Micron's vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on one thing:
using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
Req. ID:
225461
Role can be located in San Jose, CA or Boise, ID.
As a Package Design Engineer within the Package Development and Engineering team for Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a cross-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/lead frame layout, wire bond diagrams, and other design documentation. You will be required to complete design activities within the project schedule and ensure that design outputs are within Assembly and vendor capability.
Responsibilities include the following, but not limited to:
Codesign Coordination and Management
- Support feasibility studies and risk assessment for various package options
- Interact with and support die design to enable silicon architecture development
- Interact with key Business Unit stakeholders and assembly subcontractor partners to recommend package solutions to meet customer and/or market requirements
- Support package technology development, including material selection, process development, DOEs, and related activities
- Support packaging IP development
- Provide design support for thermal/mechanical/electrical simulation analysis
- Support the design group's continuous improvement efforts
- Support global design alignment activities
- Contribute to package design rules and system development
- Contribute to package roadmaps
- Contribute to the Competitive Analysis review process
Create Package Designs
- Support die padslog layout/optimization
- Design highly integrated packages using advanced BEOL and RDL flows with an emphasis on optimal electrical performance, manufacturability, and reliability. Work with customers requiring Advanced Packaging technology, internal process design teams, OSATs, and other ecosystem partners
- Lead set up of designs, rules, and routing methodologies for advanced processes developed by the Advanced Packaging Development Center
- Lead package and DFMEA (Design for Manufacturing) reviews. Guide design reviews with assembly engineering and subcon teams
- Generate documentation. Ensure timely updates of all assembly documents in database. Provide accurate drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings
- Work alongside assembly engineering to work with PCB suppliers, SMT service companies, OSATs, EMS companies, and other ecosystem partners. Translate their requirements into advanced packaging solutions
Contribute to a Safety Compliant Work Environment
- Identify and promptly report hazards
- Follow safety procedures and area work rule
- Operate and maintain equipment and tools within manufacturer and company guidelines
- Use proper lifting techniques and work in an ergonomically correct manner
Qualifications
- PhDEE (preferred) or MSEE with a minimum of 3 years of industry or curriculum-based semiconductor packaging experience within the following areas:
- Controller and/or Advanced Memory Substrate Design (flip chip / wire bond)
- PCB Design
- Signal/Power Integrity Analysis/Optimization
- Cadence and AutoCAD tools
- Assembly Process/Materials
- Assembly DOE definition/management
- Product Engineering
- Quality and Reliability
- Good computer skills and proficient in MS Office
- CAD experience (Cadence and AutoCAD preferred)
- Detail orientated
- Strong oral and written communication skills
- Ability to interact and work in a team environment
- Advanced electrical circuit knowledge
- Ability to read and interpret drawings and schematics
- Ability to prioritize and manage multiple projects
- Travel as required
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions. Through our global brands “ Micron and Crucial “ our broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, 3D XPoint memory and NOR, is transforming how the world uses information to enrich life. Backed by more than 40 years of technology leadership, our memory and storage solutions enable disruptive trends, including artificial intelligence, 5G, machine learning and autonomous vehicles, in key market segments like mobile, data center, client, consumer, industrial, graphics, automotive, and networking. Our common stock is traded on the Nasdaq under the MU symbol. To learn more visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
For US Sites Only:
To request assistance with the application process and/or for reasonable accommodations, please contact Micron's Human Resources Department at 1-800-336-8918 or 208-368-4748 and/or by completing our General Contact Form
Keywords:
Boise Idaho (US-ID) United States (US) Backend Manufacturing Experienced Regular Engineering #LI-CM1 Tier 3
Estimated Salary: $20 to $28 per hour based on qualifications.
|
|
 | |
